| 摘要 |
A method for modeling devices in a wafer comprises the step of providing the wafer comprising a first plurality of devices having a track width and a first stripe height, a second plurality of devices having the track width and a second stripe height, and a third plurality of devices having the track width and a third stripe height. The method further comprises the steps of measuring resistance values for the first, second and third plurality of devices to obtain a data set correlating a stripe height and a resistance value for each of the first, second and third plurality of devices, and estimating a linear relationship between resistance and inverse stripe height for the first, second and third plurality of devices based on the data set. |
