| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating method, capable of efficiently executing the plating process with high reliability without degrading the precipitation rate of electroless plating, and controlling the cost. <P>SOLUTION: An electroless plating apparatus 1 includes a plating tank 13, wherein the inside of the plating tank 13 is filled with plating liquid 3 for executing the plating on a printed circuit board 15 by the electroless plating. A lid material 7 is provided on an upper surface of the plating tank 13, and a slit 9 for allowing a substrate 15 to pass therethrough is formed in the lid material 7. A space 11 surrounded by the liquid level side of the lid material 7 and the liquid level of the plating liquid 3 is filled with inert gas. <P>COPYRIGHT: (C)2013,JPO&INPIT |
