| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board capable of making the wiring board thinner. <P>SOLUTION: A manufacturing method of a wiring board 10 comprises: a first step S20 of forming a film-like substrate 20 on a film substrate 100 by coating a first insulating liquid 21 on the film substrate 100 and curing the liquid; a second step S30 of forming a wiring pattern 30 on the film-like substrate 20 by printing a conductive paste 33 on the film-like substrate 20 and curing the conductive paste; a third step S40 of forming a protective layer 40 which protects at least a part of the wiring pattern 30 by printing a second insulating liquid 41 on at least the part of the wiring pattern 30 and curing the insulating liquid; and a fourth step S50 of peeling the film-like substrate 20 from the film substrate 100. <P>COPYRIGHT: (C)2013,JPO&INPIT |
