| 摘要 |
<P>PROBLEM TO BE SOLVED: To pressurize substrates by simple controls without damaging them even during bonding when taking out multiple airtight containers 10, in a method of manufacturing the airtight container 10 in which a frame member 14 surrounding the periphery of a gap between a first substrate 12 and a second substrate 13 is placed between both of them, and the first substrate 12 and the second substrate 13 are respectively bonded to the frame member 14. <P>SOLUTION: An assembly structure 30 including the first substrate 12, the second substrate 13, the frame member 14, and a bonding material 11 provided between at least one of the first substrate 12 and the second substrate 13 and the frame member 14 is prepared, it is housed in a sealed container 40 in which a top face part 45 can be brought down by making an internal pressure lower than an external pressure, the top face part 45 is brought down by making the internal pressure of the sealed container 40 lower than the external pressure thereof, and the first substrate 12 facing the top face part or the second substrate 13 is bonded to the bonding material 11 in a pressurized state. <P>COPYRIGHT: (C)2013,JPO&INPIT |
