发明名称 |
RESIN COMPOSITION FOR FORMING CONDUCTIVE INK ABSORBING LAYER, CONDUCTIVE INK ABSORBING BASE MATERIAL, BOARD FOR FORMING CIRCUIT, PRINTED MATTER, CONDUCTIVE PATTERN, AND CIRCUIT BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for forming a conductive ink absorbing layer with which an ink absorbing layer having excellent adhesiveness between conductive ink and the ink absorbing layer and adhesiveness between the ink absorbing layer and various types of support bodies can be formed, bleed of the conductive ink is prevented, and the ink absorbing layer with a thinning property can be formed. <P>SOLUTION: The resin composition for forming the conductive ink absorbing layer contains a vinyl polymer (A) obtained by polymerizing a vinyl monomer mixture having: 10-70 mass% of alkyl (meth)acrylate ester (a1) which is one or more types selected from a group of methyl (meth)acrylate and ethyl (meth)acrylate; and 10-70 mass% of alkyl (meth)acrylate ester (a2) having a 3-8C aliphatic or alicyclic alkyl group. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012218318(A) |
申请公布日期 |
2012.11.12 |
申请号 |
JP20110087228 |
申请日期 |
2011.04.11 |
申请人 |
DIC CORP |
发明人 |
SAITO KIMIE;FUJIKAWA WATARU;SHIRAGA JUN |
分类号 |
B41M5/00;B41M5/50;B41M5/52 |
主分类号 |
B41M5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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