| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact IC module which does not require connection of terminal parts of loop-like circuits provided on the front and back sides of an upper and a lower substrates and is thin and flat even though it is composed of multiple layers. <P>SOLUTION: A non-contact IC module comprises a first substrate having a loop-like circuit on at least one side and a second substrate which is laminated on the first substrate and has a loop-like circuit on at least one side in the surrounding area of an opening, with an IC chip mounted with its face down on the first substrate exposed in the opening. On the first substrate exposed in the opening, a capacitor is mounted. <P>COPYRIGHT: (C)2013,JPO&INPIT |
