| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip package and its manufacturing method. <P>SOLUTION: An embodiment of the present invention provides a manufacturing method of a chip package including: a step of providing a semiconductor wafer having a plurality of device regions separated by a plurality of scribe lines; a step of bonding a package substrate to the semiconductor wafer and installing a spacer layer between the package substrate and the semiconductor wafer, in which the spacer layer defines a plurality of cavities respectively exposing the device regions and has a plurality of through-holes neighboring an outer edge of the semiconductor wafer; a step of filling an adhesive material in the through-holes, in which the spacer layer has viscosity and the material thereof is different from the adhesive material; and a step of dicing the semiconductor wafer, the package substrate, and the spacer layer along the scribe lines to form a plurality of chip packages separated from each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
