发明名称 CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a circuit board that can prevent cracking thereof and can alleviate warping thereof while suppressing deterioration of mechanical strength and preventing cracks from progressing to an individual board region. <P>SOLUTION: Dividing grooves 14p, 14q, 14x, 14y are formed in a lattice shape on a boundary line between a center part 12 having a rectangular shape and a peripheral part 13 surrounding the whole periphery of the center part 12 and inside the center part 12. Alleviating grooves 16p, 16q, 17p, 17q, 18 linking first points 15k, 15p, 15q, 15r, 15s where two dividing grooves 14p, 14q, 14x, 14y are connected on the boundary line between the center part 12 and the peripheral part 13 to second points 11p, 11q, 11r, 11s on peripheral fringes 13x, 13y of the peripheral part 13, and obliquely connected to any of the two dividing grooves 14p, 14q, 14x, 14y are formed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012222085(A) 申请公布日期 2012.11.12
申请号 JP20110084779 申请日期 2011.04.06
申请人 MURATA MFG CO LTD 发明人 MATSUMURA SADAYUKI
分类号 H05K1/02 主分类号 H05K1/02
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