HEAT RADIATING COMPONENT FOR SEMICONDUCTOR, CASE FOR SEMICONDUCTOR WITH THE SAME, AND CARRIER FOR SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a high-precision heat radiating component for a semiconductor in which a manufacturing process is simple, and which is economical and has high productivity by using a Cr-Cu alloy which has a small coefficient of thermal expansion and large coefficient of thermal conductivity, and to provide a semiconductor case, a semiconductor carrier and a package.

SOLUTION: A heat radiating component for a semiconductor is a molded product produced by cold pressing a Cr-Cu alloy plate obtained by processing a Cr-Cu alloy which is produced by applying powder metallurgy. The molded product comprises more than 30 mass% and less than or equal to 80 mass% of Cr content with the balance consisting of Cu and unavoidable impurities. The unavoidable impurities are less than or equal to 0.15 mass% of O, less than or equal to 0.1 mass% of N, less than or equal to 0.1 mass% of C, less than or equal to 0.05 mass% of Al, and less than or equal to 0.10 mass% of Si.

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