发明名称 Roughened copper foil, method for producing same, copper clad laminated board, and printed circuit board
摘要 Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 µm and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 µm or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 µm, a height of 0.4-1.8 µm and an aspect ratio [height/width] of 1.2-3.5.
申请公布号 KR20120123451(A) 申请公布日期 2012.11.08
申请号 KR20127021811 申请日期 2011.01.21
申请人 发明人
分类号 C25D7/06;B32B15/01;B32B15/08;H05K1/09 主分类号 C25D7/06
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