| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a room temperature-curing polyorganosiloxane composition for sealing an electronic part, in which the flowability before and immediately after the curing is favorable, which is excellent in curability and flame retardancy, and in which the cured product excels in the adhesion to various substrates. <P>SOLUTION: The flame retardancy polyorganosiloxane composition for sealing an electronic part includes: (a) a condensation reaction type polyorganosiloxane composition which includes (a1) a polyorganosiloxane in which both molecular chain terminals are blocked by a hydroxyl group and the viscosity (23°C) is 0.05-50 Pa s, (a2) an alkoxysilane and/or a hydrolytic condensate thereof, (a3) an amino group substituted alkoxysilane, and (a4) a curing catalyst; and (b) 0.5-20 pts.mass of an expandable graphite in which the average particle diameter is 150-400 μm, and the expansion coefficient is at least 150 volume% based on 100 pts.mass of the (a1) component which is a base polymer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
