| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a temperature characteristic inspection device of a semiconductor light-emitting element capable of being realized at a low cost without increasing a chip area in high temperature characteristic inspection of the semiconductor light-emitting element, and to provide a temperature characteristic inspection method. <P>SOLUTION: A temperature characteristic inspection device 10 includes a device 1 for current application and voltage measurement and a semiconductor light-emitting element 2 to be measured. The device 1 for current application and voltage measurement includes a current application part 11 and a voltage detection part 12. The device 1 for current application and voltage measurement, for example, is a chip prober in which a probe is applied to an electrode of the semiconductor light-emitting element 2 being in the wafer state to apply current and measure voltage. For example, an external operation part 3 and an external determination part 4 determine whether the temperature characteristics of the semiconductor light-emitting element 2 are good or bad using measured forward voltage values and optical output values. <P>COPYRIGHT: (C)2013,JPO&INPIT |
