| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve improvement of manufacturing efficiency, cost reduction, and improvement of reliability. <P>SOLUTION: A first field-effect transistor of a first conductivity type is provided on a first substrate. A second field-effect transistor of a second conductivity type different from the first conductivity type is provided on a second substrate. Subsequently, the first substrate and the second substrate are bonded so as to face each other. Next, the first field-effect transistor and the second field-effect transistor are electrically connected to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
