发明名称 PRINTED CIRCUIT BOARD AND POWER MODULE
摘要 <p>Embodiments of the present invention provide a printed circuit board and a power module. The printed circuit board comprises an insulating layer, a first planar conductive layer located above the insulating layer, and a second planar conductive layer located below the insulating layer. The insulating layer, the first planar conductive layer and the second planar conductive layer each are provided with a magnetic core groove having a penetrating magnetic core. The printed circuit board further comprises: at least one group of vertical conductive winding, configured to cooperate with the magnetic core mounted in the magnetic core groove to perform electromagnetic conversion. In the direction perpendicular to the insulating layer, one side of the at least one group of vertical conductive winding is located a position on the insulating layer or the first planar conductive layer except the magnetic core groove, and the other side of the at least one group of vertical conductive winding is located on a position on the insulating layer or the second planar conductive layer except the magnetic core groove. The printed circuit board can expand the sectional area of the conductive winding, and reduce the alternating current impedance of the power module.</p>
申请公布号 WO2012149740(A1) 申请公布日期 2012.11.08
申请号 WO2011CN79621 申请日期 2011.09.14
申请人 HUAWEI TECHNOLOGIES CO., LTD.;HOU, ZHAOZHENG;MAO, HENGCHUN;FU, DIANBO;HUANG, LIANGRONG 发明人 HOU, ZHAOZHENG;MAO, HENGCHUN;FU, DIANBO;HUANG, LIANGRONG
分类号 H05K1/16;H01F5/00;H01F17/00;H02M1/00 主分类号 H05K1/16
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