发明名称 |
METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
摘要 |
Quickly making changes to etching conditions suppresses the production yield of printed wiring boards from being deteriorated. Disclosed is a method comprising: an etching step that comprises: preparing a conductor-clad base material continuous in a certain direction, the conductor-clad base material (1) having an insulating layer and one or more conductive layers formed on main surfaces of the insulating layer; and subjecting a predetermined region of a conductor layer of one main surface of the conductor-clad base material (1) to an etching process thereby to form a wiring pattern (1a) to be of a product and an inspection pattern (1b) to be used for inspection; a measuring step that measures a line width of the inspection pattern after the etching step; and a control step that controls an etching condition in the etching step based on the measured line width. |
申请公布号 |
US2012279050(A1) |
申请公布日期 |
2012.11.08 |
申请号 |
US201213462399 |
申请日期 |
2012.05.02 |
申请人 |
WATANABE HIROHITO;OGAWA TAIJI;TOMONAGA TAKAOMI;TOMONAGA ERIKO;FUJIKURA LTD. |
发明人 |
WATANABE HIROHITO;OGAWA TAIJI;TOMONAGA TAKAOMI;TOMONAGA ERIKO |
分类号 |
H05K3/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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