| 摘要 |
<p>PURPOSE: A light emitting device package and a light emitting module using an ultraviolet light emitting diode are provided to secure a heat radiation property by attaching a heat radiation member to a silicon body and forming a second member on the heat radiation member. CONSTITUTION: A silicon body includes a cavity(15). An ultraviolet light emitting diode is formed in the cavity. A first member(90) is formed on the lower side of the silicon body. A second member is formed on the first member and surrounds the silicon body. A light transmitting film(80) is combined with the second member to cover the silicon body.</p> |
