| 摘要 |
A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package (100) includes, for example, a wiring substrate (101) having an opening (102); a light-emitting device (104) that is disposed on the wiring substrate and covers the opening; a bonding wire (106) electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member (107) that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist (109) and a solder bump (110) formed on the bottom surface of the wiring substrate. |
