<p>A method for treating a film by providing a structure including a substrate and an array of upstanding projections each of which includes multiple contact points. The structure is pressed against the surface of a polymeric film to cause deformation or rupture of the film. The film may then be pressed to partially reseal the perforations. The structure can be produced by electroplating a mould which includes an array of elements of dimensions corresponding to the projections of the desired structure.</p>
申请公布号
EP1345753(B1)
申请公布日期
2012.11.07
申请号
EP20010983329
申请日期
2001.11.20
申请人
AMCOR PACKAGING (AUSTRALIA) PTY, LTD
发明人
HARVEY, EROL, CRAIG;WAYCOTT, RAMON, GLENNY;CAREW, DAVID LEE