发明名称 METHOD FOR TREATING FILMS
摘要 <p>A method for treating a film by providing a structure including a substrate and an array of upstanding projections each of which includes multiple contact points. The structure is pressed against the surface of a polymeric film to cause deformation or rupture of the film. The film may then be pressed to partially reseal the perforations. The structure can be produced by electroplating a mould which includes an array of elements of dimensions corresponding to the projections of the desired structure.</p>
申请公布号 EP1345753(B1) 申请公布日期 2012.11.07
申请号 EP20010983329 申请日期 2001.11.20
申请人 AMCOR PACKAGING (AUSTRALIA) PTY, LTD 发明人 HARVEY, EROL, CRAIG;WAYCOTT, RAMON, GLENNY;CAREW, DAVID LEE
分类号 B29C59/02;A61F13/15;B26F1/24;B29C33/38;B29C59/04;B29C67/20 主分类号 B29C59/02
代理机构 代理人
主权项
地址