| 摘要 |
The present invention relates to (1) a mesoporous silica film having a mesoporous structure including meso pores having an average pore period of from 1.5 to 6 nm, wherein the meso pores are oriented in the direction of an angle of from 75 to 90° relative to a surface of the film; (2) a structure including a substrate and the mesoporous silica film formed on the substrate; and (3) a process for producing a mesoporous silica film structure which includes the steps of preparing an aqueous solution containing a specific amount of a specific cationic surfactant; immersing a substrate in the aqueous solution and then adding a specific amount of a silica source capable of forming a silanol compound when hydrolyzed, to the aqueous solution, followed by stirring the resulting mixture at a temperature of from 10 to 100° C., to form a mesoporous silica film on a surface of the substrate; and removing the cationic surfactant from the resulting mesoporous silica film structure. |
