发明名称 Method for placing at least one component provided with connection points on a substrate, as well as such a device
摘要 A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions.
申请公布号 US8306313(B2) 申请公布日期 2012.11.06
申请号 US20080167083 申请日期 2008.07.02
申请人 HOOGERS HUBERT FRANCIJN MARIA;ASSEMBLEON B.V. 发明人 HOOGERS HUBERT FRANCIJN MARIA
分类号 G06K9/00 主分类号 G06K9/00
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