发明名称 Deposit removing method and substrate processing method
摘要 A deposit removing method that can reliably remove deposit produced in plasma processing using plasma produced from a process gas containing methane gas and oxygen gas. In a chamber in which an electrode to which radio frequency electrical power is supplied is disposed, plasma processing is carried out on a substrate using the plasma produced from the process gas containing methane gas and oxygen gas, and then a cleaning step is carried out in which plasma is produced from a mixed gas containing fluorinated compound gas containing hydrogen in the chamber.
申请公布号 US8303719(B2) 申请公布日期 2012.11.06
申请号 US20090389057 申请日期 2009.02.19
申请人 LEE SUNGTAE;NAKAGAWA YUSUKE;YASHIRO JUN;TOKYO ELECTRON LIMITED 发明人 LEE SUNGTAE;NAKAGAWA YUSUKE;YASHIRO JUN
分类号 B08B9/08;B08B5/00 主分类号 B08B9/08
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