首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Edge profile
摘要
申请公布号
PL119979(U1)
申请公布日期
2012.11.05
申请号
PL20110119979U
申请日期
2011.04.29
申请人
RENOPLAST SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA
发明人
GAWRON MAREK
分类号
E04F19/02;E04B1/00;E04D13/04;E04D13/15
主分类号
E04F19/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
IMAGE SENSOR AND IMAGE PROCESSING SYSTEM INCLUDING THE SAME
HIGH DIELECTRIC CONSTANT STRUCTURE FOR THE VERTICAL TRANSFER GATES OF A COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) IMAGE SENSOR
FORMATION OF BURIED COLOR FILTERS IN A BACK SIDE ILLUMINATED IMAGE SENSOR WITH AN ONO-LIKE STRUCTURE
DISPLAY DEVICE INTEGRATED WITH TOUCH SCREEN PANEL AND METHOD FOR FABRICATING THE SAME
TOUCH SENSOR, TOUCH PANEL, TOUCH PANEL MODULE, AND DISPLAY DEVICE
THIN FILM TRANSISTOR AND METHOD FOR REPAIRING THE SAME, GOA CIRCUIT AND A DISPLAY DEVICE
NON-VOLATILE MEMORY DEVICE
BANDGAP-ENGINEERED MEMORY WITH MULTIPLE CHARGE TRAPPING LAYERS STORING CHARGE
ESD PROTECTION DEVICE
METHODS OF PROCESSING WAFER-LEVEL ASSEMBLIES TO REDUCE WARPAGE, AND RELATED ASSEMBLIES
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
CRACKSTOPS FOR BULK SEMICONDUCTOR WAFERS
SELF-ALIGNED CONTACT STRUCTURE
SEMICONDUCTOR DEVICE WITH CONTACTS AND METAL INTERCONNECTS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
EMBEDDED CHIP PACKAGING TECHNOLOGY
MICRO LEAD FRAME STRUCTURE HAVING REINFORCING PORTIONS AND METHOD
HEAT CONDUCTIVE SHEET AND STRUCTURE
HEAT SPREADING LAYER WITH HIGH THERMAL CONDUCTIVITY
METHOD FOR FABRICATING AND MANUFACTURING MICRO- and NANO-FABRICATED DEVICES AND SYSTEMS SECURELY
METHOD AND DEVICE FOR MASS SPECTROMETRY
