| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that keeps intact linearity of an input-output characteristic of an amplification circuit included in the semiconductor device and keeps intact linearity of an input-output characteristic of an amplifier itself. <P>SOLUTION: The semiconductor device is a package in which a semiconductor chip 71 is mounted on a wiring board 72 having a plurality of terminals for external connection. The semiconductor device includes at least one differential amplifier 61 formed on the semiconductor chip, and at least one balun 62 formed on the semiconductor chip 71 with a balanced signal line connected to the differential amplifier 61. Grounding wiring of the differential amplifier 61 and grounding wiring of the balun 62 are separately formed on the semiconductor chip 71, and the number of bonding wires 77 connecting the single grounding wiring of the differential amplifier 61 to the wiring board 72 is larger than the number of bonding wires 77 connecting the single grounding wiring of the balun 62 to the wiring board 72. <P>COPYRIGHT: (C)2013,JPO&INPIT |
