| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low-cost MEMS sensing device. <P>SOLUTION: A MEMS sensing device 20 comprises a substrate 21 and a MEMS device region 27, a thin film layer 29, an adhesive layer 22, and a plurality of Si through electrodes 26 located on the substrate 21. The substrate 21 has a first surface 211 and a second surface 212, and the MEMS device region 27. The thin film layer 29 forms a hermetically sealed space by covering the MEMS device region 27 to hermetically seal a chamber. A cap 24 sticks to the MEMS device region 27 by the adhesive layer 22. The plurality of Si through electrodes 26 is electrically connected to the MEMS device region 27 so as to extend up to the second surface 212. <P>COPYRIGHT: (C)2013,JPO&INPIT |
