| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer container the semiconductor wafer contained therein is hardly broken even if the wafer container is dropped sideways accidentally. <P>SOLUTION: Elastic-deformation aid parts (11X, 12X) for increasing the elastic deformation amount of a wafer temporary placing part (10) are formed in the wafer temporary placing part (10) so that the wafer temporary placing part (10) is deformed elastically in a range of displacement amount of 2.5-10 mm at a part (12A) abutting against a semiconductor wafer (W), when a load equal to 35 times of the self-weight of a plurality of semiconductor wafers (W) is applied laterally to a wafer container containing the plurality of semiconductor wafers (W) in the direction parallel with the surface of the semiconductor wafer (W). <P>COPYRIGHT: (C)2013,JPO&INPIT |
