发明名称 METHOD FOR BONDING HARDENED SILICONE RESIN, METHOD FOR JOINING SUBSTRATE HAVING FINE STRUCTURE, AND METHOD FOR MANUFACTURING MICRO FLUID DEVICE USING THE METHOD FOR JOINING
摘要 A method for adhering a major substrate to which nano sized concave and convex structures are formed without damaging the concave and convex structures can be used in a production method of a microfluidic device including nano sized fluidic channels. The substrates may be adhered under heat free and adhesive agent free environment by exciting the substrate surface including hard silicone resin with atmospheric plasma or vacuum ultraviolet light, then juxtaposing and pressurizing the surface of the hard silicone resin substrate and glass substrate. The silicone rubber composition is applied on the contact face of the cover substrate and then the silicone rubber composition is cured to form the silicone rubber layer and then the ultraviolet light is exposed under the condition that the surface of the major substrate being formed with concave and convex structures is contacted closely to the silicone rubber layer of the cover substrate.
申请公布号 KR20120120241(A) 申请公布日期 2012.11.01
申请号 KR20127018890 申请日期 2011.01.19
申请人 发明人
分类号 B29C65/00;G01N37/00 主分类号 B29C65/00
代理机构 代理人
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