MODULAR CHIP LAYOUT FOR ACTIVE OPTICAL LINKS

摘要

A system for optical communication comprises a chip connected to optoelectronic devices on one side and electronic circuitry on the other side using pads (1204, 1205) on the integrated circuit (1201). The chip comprises one or more integrated circuits (1201). Each integrated circuit (1201) contains one or more channel-circuits (1203) and a digital interface (1202) for controlling the channel- circuits (1203). The channel-circuits (1203) can receive or transmit electrical signals to and from optoelectronic devices via pads (1204, 1205) using circuits for driving the lasers or for receiving optical signals. Each integrated circuit (1201) can have one or more channels. In order to make a multichannel optical chip a number of integrated circuits (1201) can be selected by scribing the required number of integrated circuits (1201) from a wafer. The integrated circuits (1201) are spaced apart with a distance big enough to be scribed.