| 发明名称 |
Semiconductor Device and Method of Making a Semiconductor Device |
| 摘要 |
A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate.
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| 申请公布号 |
US2012273935(A1) |
申请公布日期 |
2012.11.01 |
| 申请号 |
US201113097851 |
申请日期 |
2011.04.29 |
| 申请人 |
MARTENS STEFAN;HIN TZE YANG;QUECK KIAN PIN;ONG KATHLEEN;TAN CHIN WEI RONNIE;SEE BENG KEH;KRUMBEIN ULRICH;THEUSS HORST |
发明人 |
MARTENS STEFAN;HIN TZE YANG;QUECK KIAN PIN;ONG KATHLEEN;TAN CHIN WEI RONNIE;SEE BENG KEH;KRUMBEIN ULRICH;THEUSS HORST |
| 分类号 |
H01L23/498;H01L21/50;H01L21/78 |
主分类号 |
H01L23/498 |
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