| 摘要 |
PURPOSE: A test carrier is provided to avoid the contact of a first member and a second member by forming the height of a first bump of the first member higher than the height of a second bump of an electronic component. CONSTITUTION: A test carrier comprises a base film(40) of a film shape of a die(90) and a cover film(70). The base film of the film shape comprises a first bump(42) contacting a test pad(91) of the die. The cover film is laid over the base film. The test film accepts the die between the base film and the cover film. The height of the first bump is higher than the height of a second bump(92) of the die. |
