发明名称 |
Method of manufacturing circuit board |
摘要 |
<p>In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste (120) obtained by mixing a fiber piece (108a-d) is recovered to obtain a recovery paste; filtration is carried out through a filter (121); a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste (122) is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.</p> |
申请公布号 |
EP2519090(A1) |
申请公布日期 |
2012.10.31 |
申请号 |
EP20120165084 |
申请日期 |
2012.04.23 |
申请人 |
PANASONIC CORPORATION |
发明人 |
HIMORI, TSUYOSHI;KATSUMATA, MASAAKI;KONDOU, TOSHIKAZU |
分类号 |
H05K3/40;B23K35/02;B23K35/30;H05K3/46 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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