| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component packaging apparatus and a method of packaging electronic components for starting packaging operation of electronic components after setting a nozzle to a state, where normal operation can be expected. <P>SOLUTION: Nozzles 7, 9 comprising a base section 20, a movable section 21, and a compression spring 30 for energizing the movable section 21 downward, by repeating extending/contracting operation for a plurality of times by elevating/lowering operation of an elevating/lowering section 8a, are placed under same circumstances as those in which regular operation is performed so that an outer-periphery surface 23 of the movable section 21 slides against an inner-periphery surface 24 of the base section 20 to extend/contract the compression spring 30, thus assuming a state where normal operation can be expected. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
