发明名称 Method for forming thick film pattern, method for manufacturing electronic component, and photolithography photosensitive paste
摘要 A method for forming a thick film pattern forms a thick film pattern having a large thickness, a high hardness, and a high aspect ratio and exhibiting high dimension precision and high shape precision. In the method, a photosensitive paste including an inorganic powder, a photosensitive monomer, and a photopolymerization initiator and containing substantially no polymer is applied to a support so as to form a photosensitive paste film. The resulting photosensitive paste film is subjected to an exposure treatment and, thereafter, development is conducted so as to form a predetermined thick film pattern. Alternatively, a photolithography photosensitive paste including an inorganic powder, a photosensitive monomer, a photopolymerization initiator, and a polymer is used, wherein a ratio (weight ratio) of the photosensitive monomer to a total amount of the photosensitive monomer and the polymer is about 0.86 or more.
申请公布号 US8298754(B2) 申请公布日期 2012.10.30
申请号 US20040596000 申请日期 2004.10.21
申请人 KANBARA HIROYUKI;TOWATA SHUUICHI;IHA MICHIAKI;MURATA MANUFACTURING CO., LTD. 发明人 KANBARA HIROYUKI;TOWATA SHUUICHI;IHA MICHIAKI
分类号 G03F7/027;G03F7/004;G03F7/26;G03F7/30;H05K3/02 主分类号 G03F7/027
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