| 摘要 |
A method for manufacturing a light emitting diode package, includes: providing a light emitting chip structure comprising a substrate and a light emitting layer; treating the light emitting layer to form at least two spaced light emitting chips on the substrate, the light emitting chips each comprising a first surface away from the substrate and a second surface; forming a first carbon nanotube layer covering the first surfaces of the at least two spaced light emitting chips; removing the substrate; forming a second carbon nanotube layer on the second surfaces of the light emitting chips, thus obtaining a first carbon nanotube layer and a second carbon nanotube layer on opposite sides of the at least two spaced light emitting chips; and packaging the light emitting chip structure to obtain the light emitting diode package. |
