ENCAPSULATING LIQUID RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING ENCAPSULATING LIQUID RESIN COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

The purpose of the present invention is to provide an encapsulating liquid resin composition having both high heat conductivity and high gap inflow performance. The present invention provides an encapsulating liquid resin composition which comprises (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, and is characterized in that the inorganic filler (C) comprises a mixture of (1) spherical alumina having an average diameter of 0.5 µm or more and less than 1.0 µm and (2) spherical alumina having an average diameter of 1.0 µm or more and less than 3.0 µm and the pH value is greater than 7.