摘要 |
<p>A cooling device is provided with a heat receiving unit to which heat released from a heating element is delivered, and a heat release unit which is connected to the heat receiving unit via a heat release path and a return path. A coolant passes through the heat release path, the heat release unit, and the return path from the heat receiving unit, and returns to the heat receiving unit from the inflow port of the return path. The heat receiving unit is provided with a heat receiving plate which is in contact with the heating element and absorbs heat, and a heat receiving cover which covers the heat receiving plate and forms a heat receiving space for evaporating the coolant flowing therein, and the return path is provided with a first check valve which opens by the head pressure of the coolant condensed and stayed at the inflow port.</p> |
申请人 |
PANASONIC CORPORATION;SATO, KAORU;SUGIYAMA, MAKOTO;NOGAMI, WAKANA;MIYAKE, SHUNJI;SUZUKI, AYAKA |
发明人 |
SATO, KAORU;SUGIYAMA, MAKOTO;NOGAMI, WAKANA;MIYAKE, SHUNJI;SUZUKI, AYAKA |