| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive with which a circuit board hardly causing an increase of connection resistance at a connection and separation of an adhesive and remarkably improved in connection reliability can be manufactured. <P>SOLUTION: An anisotropic conductive adhesive for circuit member connection is interposed between circuit electrodes facing with each other and, when pressure is applied between the circuit electrodes facing with each other, electrically connects between the electrodes in the pressurized direction. The adhesive contains: an adhesive resin composition including an epoxy resin having a skeleton including at least one naphthalene ring in one molecule and a latent curing agent; an inorganic filler selected from a group consisting of fused silica, crystalline silica, calcium silicate, alumina and calcium carbonate and having an average particle size of 3 μm or less; and a conductive particle. A content of the inorganic filler in the adhesive is 40-90 pts. wt. relative to 100 pts. wt. of the adhesive resin composition, and an average thermal expansion coefficient at 120-140°C after curing of the adhesive is 120 ppm or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
