发明名称 THERMAL HEAD
摘要 <P>PROBLEM TO BE SOLVED: To improve reliability of a thermal head used for a thermal printer. <P>SOLUTION: A heating element plate 20 is placed on an upper surface of a radiator plate 30 adjacently to a circuit board 40 in a sub-scanning direction. Moreover, the heating element plate 20 includes a reinforcing metal group 70 not electrically connected to a common electrode 28a on the upper surface between the common electrode 28a formed at a position closer to the circuit board 40 relative to an individual electrode 28b, and an end close to the circuit board 40 in a thermal insulation layer 22b. The individual electrode 28b is connected to a driving IC 42 mounted in the circuit board 40 by a bonding wire 44. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012206302(A) 申请公布日期 2012.10.25
申请号 JP20110072077 申请日期 2011.03.29
申请人 TOSHIBA HOKUTO ELECTRONICS CORP 发明人 KOMORI MASAKI
分类号 B41J2/335;B41J2/345 主分类号 B41J2/335
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