| 摘要 |
A microelectronic package includes a microelectronic element including a first surface having contacts thereon, a second surface remote therefrom, and edge surfaces extending between the first and second surfaces. A reinforcing layer adheres to the at least one edge surface and extends in a direction away therefrom, the reinforcing layer not extending along the first surface of the microelectronic element. A conductive redistribution layer including a plurality of conductive elements extends from the contacts along the first surface and along a surface of the reinforcing layer beyond the at least one edge surface. An encapsulant overlies at least the reinforcing layer. The microelectronic element has a first coefficient of thermal expansion, the encapsulant has a second coefficient of thermal expansion, and the reinforcing layer has a third coefficient of thermal expansion that is between the first and second coefficients of thermal expansion.
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