| 摘要 |
Cooling apparatuses and power electronics modules with cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes a heat transfer plate having a heat output surface and a periodic fractal pattern formed in the heat output surface. The periodic fractal pattern increases the surface area of the heat output surface and provides vapor bubble nucleation sites. An enclosure encloses the heat transfer plate and forms a fluid chamber between the enclosure and the heat transfer plate. A fluid source is fluidly coupled to the fluid chamber and provides cooling fluid to the fluid chamber. When the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source.
|
