发明名称 THERMAL HEAD
摘要 <P>PROBLEM TO BE SOLVED: To prevent deterioration in print quality due to manufacturing of a thermal head. <P>SOLUTION: A plurality of heat resistors 25 aligned along a main scanning direction, a driving IC42 sealed by a thermoset resin 48 and driving the heat resistors 25, and a connecting terminal 28 electrically connected to the driving IC 42, are arranged in a heating element plate 20. On a surface opposed to the heating element plate 20 of a circuit board 50 with a circuit for feeding a current to the driving IC 42, a connecting terminal 55 electrically connected to the circuit is arranged. The heating element plate 20 and the circuit board 50 are respectively placed on a heating element placing part 32 and a circuit board placing part 33 on a placing surface 31 of a radiator plate 30. Moreover, the circuit board 50 is fixed to the radiator plate 30 and the heating element plate 20 by a mounting screw 64 with the connecting terminal 28 and the connecting terminal 55 opposed and electrically connected. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012206273(A) 申请公布日期 2012.10.25
申请号 JP20110071814 申请日期 2011.03.29
申请人 TOSHIBA HOKUTO ELECTRONICS CORP 发明人 KOMORI MASAKI
分类号 B41J2/335 主分类号 B41J2/335
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