| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame and a semiconductor device, capable of improving connection reliability to a bonding wire. <P>SOLUTION: A lead frame 1 includes a substrate frame 2 containing a die pad 3 on which a semiconductor element 21 is mounted, an inner lead 7 arranged by a plurality of numbers around the die pad 3, and an outer lead 8 configured with the inner lead 7 as one body. A plating 15A consisting of four layers is applied on the substrate frame 2, being a region sealed with a sealing resin 23 and also being a portion to which at least a bonding wire 22 is connected, in other words on the inner lead 7. The plating 15A consisting of four layers contains a first plating layer 11 of Ni or Ni alloy, a second plating 12 of Pd or Pd alloy, a third plating layer 13 of Ag or Ag alloy, and fourth plating layer 14 of Au or Au alloy. <P>COPYRIGHT: (C)2013,JPO&INPIT |
