| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a thermosetting resin material capable of enhancing storage stability, and capable of reducing a dimensional change caused by heat of a cured product after cured; and a multilayer board using the thermosetting resin material. <P>SOLUTION: The thermosetting resin material contains a thermosetting resin, a compound obtained by acylating at least one part of hydroxy group of a phenoxy resin, and a cyanate ester curing agent. The multilayer board 11 includes a circuit board 12, and cured product layers 13-16 arranged on a surface 12a formed with a circuit of the circuit board 12. The cured product layers 13-16 are formed by curing the thermosetting resin material. <P>COPYRIGHT: (C)2013,JPO&INPIT |
