| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermal head that can achieve miniaturization of a device, and a method for manufacturing the thermal head and a thermal printer. <P>SOLUTION: The thermal head includes: a head substrate 110 in which a circuit pattern with which a plurality of heating elements are formed, while the plurality of heating elements are arranged to the substrate; and a driver IC 120 which is connected to the circuit pattern to drive the heating elements. To the head substrate 110, mounting terminals 115, 116 that are connected with the circuit pattern and include the tin are set up. In the driver IC 120, bump electrodes 135a, 135b including the gold are provided for the surface opposed to the head substrate 110, and the bump electrode 135a, 135b are connected to the mounting terminals 115, 116. In the joint of the mounting terminals 115, 116, and the bump electrodes 135a and 135b, the eutectic of the tin included in the mounting terminals 115, 116, and the gold included in the electrodes 135a, 135b is formed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
