| 摘要 |
PURPOSE: An encapsulant composition for optoelectronic device is provided to obtain sealant for an optoelectronic device having high light transmittance, high durability and high reflectivity by reacting a silicone resin which has an epoxy resin or epoxy group with high refractivity, and polysilazane with excellent thermal stability. CONSTITUTION: An encapsulant composition comprises an epoxy resin, and polysilazane reacting with the epoxy resin. The epoxy resin comprises a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a biphenyl type epoxy resin, a triphenylmethane type epoxy resin, a stilbene type epoxy resin, a hydroquinone type epoxy resin, a phenolaralkyl type epoxy resin, an aliphatic epoxy resin, a glycidyl ether type epoxy resin, a bicyclic epoxy resin, or a naphthalene epoxy resin. [Reference numerals] (AA) Data about permeability of Poly(bisphenol A-co-epichlorohydrin), glycidyl end-capped, 1-(2-aminoethyl)piperazine, Poly silazane before and after 155°C 1h
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