Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure

摘要

A semiconductor device includes: an electronic component including an electrode pad forming face on which electrode pads are formed, a back face opposite to the electrode pad forming face; a sealing resin including a first face provided on the electrode pad forming face side and a second face provided on the back face side, and provided around the electronic component to seal up a side face of the electrode component; a multilayer wiring structure which is provided on the first face, and in which insulating layers, a wiring pattern and external connecting pads are stacked on each other; and a conductive member which is provided in a through-hole passing through the sealing resin and the insulating layer. The wiring pattern is directly connected to the electrode pads and the external connecting pads, and includes a wiring provided in the insulating layers. The conductive member is connected to the wiring.