| 摘要 |
PURPOSE: A method for manufacturing a light emitting diode package is provided to increase thermal performance by mounting a light emitting diode chip on a lead frame circuit layer. CONSTITUTION: A reflector(120) is formed on a lead frame base. The reflector exposes a plurality of LED chip bonding areas. A lead frame circuit layer with first second electrodes separated from the lead frame base is formed. A light emitting diode chip is mounted in order to be electrically connected to the first and second electrodes in each chip bonding area. A sealing member seals the mounted light emitting diode chip. |
