发明名称 System and method for monitoring wafer stress
摘要 A method of using a processing system that is operable to deposit liquid and to remove liquid by way of negative pressure. The method includes arranging a device to have at least one of the liquid deposited thereon by the processing system and the liquid removed therefrom by the processing system. The device has a sensor portion disposed thereon. The sensor portion can provide a sensor signal based on pressure related to the at least one of the liquid being deposited thereon by the processing system and the liquid being removed therefrom by the processing system. The method further includes performing at least one of depositing, by the processing system, the liquid onto the device and removing the liquid, by the processing system, from the device. The method still further includes providing the sensor signal, by the sensor portion, based on the pressure related to the at least one of the liquid being deposited onto the device and the liquid being removed from the device.
申请公布号 US8293023(B2) 申请公布日期 2012.10.23
申请号 US20090616415 申请日期 2009.11.11
申请人 VALCORE JOHN;KAWAGUCHI MARK;PADURARU CRISTIAN;LAM RESEARCH CORPORATION 发明人 VALCORE JOHN;KAWAGUCHI MARK;PADURARU CRISTIAN
分类号 B08B7/04 主分类号 B08B7/04
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