| 摘要 |
A semiconductor chip holding tray, includes: a base substrate; a first projection provided on the front surface of the base substrate, and disposed on a short edge side of the perimeter of a holding area, has a depression; a first raised portion provided on the front surface, and is disposed on a long edge side of the perimeter; a triangular cross-section second projection provided on the rear surface of the base substrate, and is disposed on a short edge side of the perimeter of a holding area; and a second raised portion provided on the rear surface, and is disposed on a long edge side of the perimeter of the holding area. The tray is arranged such that when two trays are stacked the second projection is fitted in the depression of the first projection. |
