发明名称 |
Method of manufacturing semiconductor device, and bonding apparatus |
摘要 |
In a first bonding step of bonding an initial ball to a pad surface, the initial ball is applied by ultrasonic vibration while in pressure contact with the pad surface and a capillary undergoes a scrubbing motion to be rotated spirally. This allows a deformation area of the initial ball to be reduced, whereby the accuracy of bonding can be improved. In a second bonding step of bonding a bonding wire to a lead surface, the capillary and the bonding wire are applied by ultrasonic vibration while in pressure contact with the lead surface and the capillary undergoes a scrubbing motion to be rotated spirally. This allows the bonding wire bonded to the lead surface to be cut reliably.
|
申请公布号 |
US8292160(B2) |
申请公布日期 |
2012.10.23 |
申请号 |
US201113214682 |
申请日期 |
2011.08.22 |
申请人 |
MARUYA YUSUKE;AOYAGI NOBUYUKI;SHINKAWA LTD. |
发明人 |
MARUYA YUSUKE;AOYAGI NOBUYUKI |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|