发明名称 REFLOW DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To reduce power consumption by supplying a medium, which is warmed after being used for cooling, into a furnace, and also to enable setting of a desired profile. <P>SOLUTION: A reflow furnace is configured such that a plurality of furnace bodies are arranged in series along a conveyance path of a heating object and at least part thereof is covered with a heat insulating material. From an inlet side to an outlet side of the conveyance path, a preheating section, a reflow section and a cooling section are arranged in this order. A medium having been used for cooling, for example, nitrogen gas is supplied to the furnace bodies included in the reflow section. Piping is provided in a zone in the preheating section adjacent to the reflow section, and the zone is cooled by the medium supplied into the piping. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012204765(A) 申请公布日期 2012.10.22
申请号 JP20110070242 申请日期 2011.03.28
申请人 TAMURA SEISAKUSHO CO LTD 发明人 SHIDA ATSUSHI;KAWAKAMI TAKEHIKO;TAMORI NOBUAKI;NAKANO HIRONOBU;SAITO KOJI;SAITO TOSHITAKE
分类号 H05K3/34;B23K1/008;B23K31/02;B23K101/42 主分类号 H05K3/34
代理机构 代理人
主权项
地址